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  us1jdf / us1m df document number: ds36877 rev. 8 - 2 1 of 5 www.diodes.com november 2014 ? diodes incorporated u s1 jdf/ us1m df 1.0a surface mount ultra - fast rectifier product summary (@ t a = +25c) v rrm (v) i o (a) v f (max) (v) i r (max) ( a ) 600,1000 1 1.7 5 description and applications the us1jdf and us1mdf are rectifier s packaged in the low pr ofi le d - flat package. providing ultra - fast r ecovery time for high efficiency, this device is ideal for use in general rectification applications such as : ? switching mode power supply ? dc - dc converter features and benefits ? glass passivated die construction ? ultra - fast recovery time for high efficiency ? surge overload rating to 30a peak ? high current capability ? low profile design, package height less t han 1.1mm ? lead - free finish; rohs compliant (notes 1 & 2) ? halogen and antimony free. green device (note 3) mechanical data ? case: d - flat ? case material: m olded plastic, green molding c ompound. ul flammability classification rating 94v - 0 ? moisture sensitivity: level 1 per j - std - 020 ? terminals: finish - matte tin a nnealed over copper l eadframe . solderable per mil - std - 202, method 208 ? polarity: cathode band ? weight: 0.0 64 grams ( a pproximate ) ordering information (note 4 ) part number qualification case packaging us1jdf - 13 commer cial d - flat 10 , 000/tape & reel us1mdf - 13 commer cial d - flat 10 , 000/tape & reel note s: 1 . eu directive 2002/95/ec (rohs) & 2011/65/eu (rohs 2) compliant. all applicable rohs exemptions applied. 2. see http://www.diodes.com/quality/lead_free.html for more information about diodes incorporateds definitions of hal ogen - and antimony - free, "green" and lead - f ree . 3. halogen - and antimony - free "green products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm tota l br + cl) and <1000ppm antimony compounds. 4. for packaging det ails, go to our website at http: //www.diodes.com/products/packages.html . marking information top view d - flat u1j or u1m = product t ype m arking c ode = manufacturers c ode m arking yww = date c ode m arking y = last d igit of y ear ( ex: 4 for 20 14) ww = week c ode ( 01 to 5 3) ab = foundry and assembly code green
us1jdf / us1m df document number: ds36877 rev. 8 - 2 2 of 5 www.diodes.com november 2014 ? diodes incorporated u s1 jdf/ us1m df maximum ratings (@ t a = +25c, unless otherwise specified.) single phase, half wave, 60hz, resistive or inductive load. for capacitance load, derate current by 20%. characteristic symbol us1j df us1m df unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage (note 5 ) v rrm v rwm v r 600 1000 v rms reverse voltage v r(rms) 420 700 v average rectified output current @t t = + 2 5 c i o 1.0 a non - repetitive peak forward surge current 8.3ms single half sine - w ave superimposed on rated load i fsm 30 a thermal characteristics characteristic symbol value unit typical thermal resistance, junction to terminal (note 8) r ? jt 44 c/w typical thermal resistance, junction to ambient (note 8) r ? j a 80 c/w operating and storage temperature range t j, t stg - 5 5 to +150 c electrical characteristics (@ t a = +25c, unless otherwise specified.) characteristic symbol us1j df us1 mdf unit minimum reverse breakdown voltage (note 5 ) @i r = 5 (br)r 600 1000 v maximum forward voltage drop @ i f = 1.0a v f 1.7 v peak reverse current @t a = + 25 c at rated dc blocking voltage (note 5 ) @t a = + 100 c i r 5.0 100 rr 75 ns typical total capacitance (note 7 ) c t 10 pf notes: 5 . short duration pulse test used to minimize self - heating effect. 6 . measured with i f = 0.5a, i r = 1.0a, i rr = 0.25a. see figure 7 . 7. measured at 1.0mhz and applied reverse voltage of 4.0v dc. 8. device mounted on fr - 4 substrate , 1" * 1", 2oz, single - sided, pc boards with 0.1"*0.15" copper pad s . 9 . device mounted on fr - 4 substrate , 0.4" * 0.5", 2oz, single - sided, pc boards with 0.2"*0.25" copper pad s . i , d c f o r w a r d c u r r e n t ( a ) f figure 1 forward current derating t , ambient temperature (c) a 0 0.20 0.40 0.60 0.80 1 1.20 25 50 75 100 125 150 note 9 note 8 0 i , i n s t a n t a n e o u s f o r w a r d c u r r e n t ( a ) f figure 2 typical forward characteristics v , instantaneous forward voltage (v) f 0 01 . 0 1 . 1 10 0 5 . 1 0 . 1 5 . 2 0 . 2 5 . 3 0 . t = -55c a t = 150c a t = 25c a t = 85c a t = 100c a t = 125c a
us1jdf / us1m df document number: ds36877 rev. 8 - 2 3 of 5 www.diodes.com november 2014 ? diodes incorporated u s1 jdf/ us1m df f=1mhz figure 5 total capacitance v , dc reverse voltage (v) r c , t o t a l c a p a c i t a n c e ( p f ) t 0 5 10 15 20 0 1 10 100 i average forward current (a) f(av) figure 6 forward power dissipation p f , a v e r a g e f o r w a r d p o w e r d i s s i p a t i o n ( w ) ( a v ) 0 0.2 0.4 0.6 0.8 1 1.2 0 0.2 0.4 0.6 0.8 1 1.2 t = 150c j note 8 0 10 20 30 40 1 10 100 i , p e a k f o r w a r d s u r g e c u r r e n t ( a ) f s m number of cycles at 60hz fig. 3 forward surge current derating curve i , i n s t a n t a n e o u s r e v e r s e c u r r e n t ( a ) r figure 4 typical reverse characteristics percent of rated peak reverse voltage (%) 0 001 . 0 01 . 0 1 . 1 10 100 20 40 60 80 100 t = -55c a t = 25c a t = 85c a t =100c a t = 125c a t = 150c a p , a v e r a g e f o r w a r d p o w e r d i s s i p a t i o n ( w ) f ( a v )
us1jdf / us1m df document number: ds36877 rev. 8 - 2 4 of 5 www.diodes.com november 2014 ? diodes incorporated u s1 jdf/ us1m df package outline dimensions please see ap02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. suggested pad layout please see ap02001 at http://w ww.diodes.com/datasheets/ap02001 .pdf for the latest version. d - flat dim min max a 0.90 1.10 b 1.25 1.65 c 0.10 0.40 d 2.25 2.95 e 3.95 4.60 k 2.80 - h e 5.00 5.60 l 0.50 1.30 all dimensions in mm dimensions value (in mm) c 4.65 g 2.80 x 1.85 x1 6.50 y 1.70 7 h d e l b a c e k x g c x1 y
us1jdf / us1m df document number: ds36877 rev. 8 - 2 5 of 5 www.diodes.com november 2014 ? diodes incorporated u s1 jdf/ us1m df important notice diodes incorporated makes no warranty of any kind, express or implied, with regards to this document, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose (and their equivalents under the laws of any jurisdiction). diodes incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. dio des incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does diodes incorporated convey any license unde r its patent or trademark rights, nor the rights of others. any customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold diodes incorporated and all the companies whose products are represented on diod es incorporated website, harmless against all damages. diodes incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthor ized sales channel. should customers purchase or use diodes incorporated products for any unintended or una uthorized application, customers shall indemnify and hold diodes incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising ou t of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. products described herein may be covered by one or more united states, international or foreign patents pending. product nam es and markings noted herein may also be covered by one or more united states, international or foreign trademarks. this document is written in english but may be translated into multiple languages for reference. only the english version of this document is the final and determinative format released by diodes incorporated. life support diodes incorporated products are specifically not authorized for use as critical components in life support devices or system s without the express written approval of the chief executive officer of diodes incorporated. as used herein: a. life s upport devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. s upport or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in th e labeling can b e reasonably expected to result in significant injury to the user. b. a critical component is any component in a life support device or system whose failure to perform can be reasonably expe cted to cause the failure of the life support device or to affect its safety or effectiveness. customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support d evices or systems, and acknowledge and agree that they are solely responsible for all lega l, regulatory and safety - related requirements concerning their products and any use of diodes incorporated products in such safety - critical, life support devices or systems, notwithstanding any devices - or systems - related information or support that may be provided by diodes incorporated. further, customers must fully indemnify diodes incorporated and its representatives against any damages arising out of the use of diodes incorporated products in such safety - critical, life support devices or systems. cop yright ? 2014, diodes incorporated www.diodes.com


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